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    Pierre Dermy

    Pierre Dermy

    Consultant

    Reno, NV, United States

    Profile · Sales Representative for Passive Optical Network components manufacturer FTTH/X Professional Certification in process. · Focus on delivering high-value to clients with...Read moreProfile

    · Sales Representative for Passive Optical Network components manufacturer
    FTTH/X Professional Certification in process.
    · Focus on delivering high-value to clients with the utmost professional commitment and integrity, great attention to details.
    · Effectively communicate with people of various social and cultural origins.
    · Manage complex projects with intricate tasks and diverse resources.
    · Control costs, track deliverables, monitor schedule progress and resources.
    · Expert electronics, IC design and engineering services
    · Design for test and manufacturability.
    · Characterize technologies and manufacturing processes.
    · Define quality assurance procedures for transfer to full-scale production.
    · Create value propositions new technologies and markets changing at a rapid pace.
    · Mentor engineers and technicians.
    · Set-up procedures and training programs on new methods and technologies.
    · Build up team of expert technologists and design contractors.
    · Manage change in rapidly evolving market conditions.

    CAD tools: Tanner EDA VLSI Pro (L-Edit, T-SPICE), Alliance VLSI Tools,
    Icarus Verilog, Altera Quartus II, Aldec HDL Express, Altium Designer, NI Labview, NI Electronics Workbench, Mathcad,
    Comsol Multiphysics, Sonnet, SolidWorks, IAR Embedded Workbench
    Programming languages: UNIX C&B-Shell, PERL, Verilog, C
    Project Management tools: MS Project, MS Office Suite

    Business achievements

    · Effectively managed high-stake projects mostly under-staffed, with short schedules and often under-funded.
    · Worked with a variety of engineering and management teams, young or seasoned professionals, with a diverse cultural background, education and experience.
    · Under high-pressure to perform on the development and/or deployment of new technologies, created and implemented new concepts, controlled costs, built-up and motivated engineering team.
    · Delivered new products and services on time and within budget.
    · Managed change in rapidly evolving market conditions.
    · Successful business negotiations with individuals and companies in Asia and Europe.
    Work history

    Advanced VLSI Engineering, Inc., Reno, Nevada
    Since 1986 to present – relocated from Nevada City, California in August 2008

    · Track record of very successful projects and excellent value delivered to more
    than 35 client companies, mostly in Silicon Valley.
    · Worked at the forefront of new technologies, in full-custom IC, ASIC, PCB, FPGA and MCU designs.
    · Wide range of applications, including high-performance RF, analog and digital electronics, optimization for high-speed or low-power, costs reduction.
    · Built an Engineering and Design Center with low start-up capital, negotiated office and equipment lease agreements with differed payments, hired engineering team, organized and guided product development projects, leveraged new technology and technical expertise for long-term contracts.
    · Organized and managed very successful and highly profitable ventures with various partners of widely different culture and social education.
    · Key contributor to major projects (example: Intel Pentium Microprocessor).
    · Published a large number of reports and documents, proprietary to clients.
    · Applied for patents on fundamental inventions and upon strategic review with client: US Patent # 6,756,838 – Negative Voltage Generator with Smart Power Regulation
    US Patent # 7,187,530 – ESD Protection Circuit
    · Design for Testability and Manufacturing.
    · Detailed documentation for Quality Assurance and contract manufacturing.

    List of projects portfolio, clients and references will be provided upon request.

    Education

    M.S.E.E. University of Cincinnati, Ohio - June 1981
    · Integrated Circuit (IC) Design and Manufacturing
    · Semiconductor Technology Development
    · Set-up and maintenance of Si Wafer Fabrication Laboratory
    · Research work on MOS tunnel diodes, photovoltaic solar cells and analog IC.
    · Thesis: " MOS Interface Trapped Charge Characterization Using
    The AC Conductance Technique "

    Diplôme d'Ingénieur de l’Ecole Supérieure d'Ingénieurs en Electronique et Electrotechnique, Paris, France - June 1980
    · Research work on GaAsInP lasers and optoelectronics, GaAs IC.
    · Contract work on data acquisition and control systems.
    · Director of Industry Relation in the Student Government.
    · National Secretary of the Students’ Body in the Société des Electriciens et Electroniciens (French equivalent of the IEEE).
    · Awarded a scholarship by the French Government for US graduate studies.

    Membership

    · Institute of Electrical and Electrical Engineers (IEEE), since 1979.
    · Technology Alliance Bridge, Silicon Valley ( http://www.tabridge.com ).
    · Chinese American Semiconductor Professional Association ( http://www.caspa.com )


    Military service

    Reserve Officer in the French Air Force.

    Area Covered: Electronics design and engineering, FTTX deployment, consulting on high-technologies and business development


    Work Experience
    -----------------

    Job Title: Consultant
    Company: Advanced VLSI Engineering, Inc.
    Description: See www.advlsi.com
    From:01/Sep/1986



    Education
    -----------------

    Degree: MSEE
    Field of Study: Microelectronics
    University / College: University of Cincinnati
    From:18/Sep/1979 To:26/Jun/1981

    Degree: Diplome d'Ingenieur (MSEE)
    Field of Study: Electronics and Computer Science
    University / College: Ecole Superieure d'Ingenieurs en Electronique et Electrotechnique - Paris, France
    From:15/Sep/1975 To:30/Jun/1980

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