Labview vi's that work with TestStand
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Description
Experience Level: Intermediate
I'm new to LabView and I need a template on how to interface with a basic prober. I'm using TestStand 2016 with the SemiConductor module and Labview 2017. You can probably get an eval license for these tools. Anyway, I've figured out how to create a basic Seq in TestStand and now I want to setup binning and the limits file referenced in the SemiConductor module. I also need to setup the prober interface. This will be with the SemiConductor HandlerProberDriver.seq and I need to create some simple vi programs with the following prober GPIB calls. The vi's I need are "T" in the following description. These plug into the HandlerProberDriver.seq at various locations. (Hopefully you know more than me. Finally I would really like to see a fully functional TestStand program that tests any single device. I just want it for reference on where things go.
The attached files are just my 1st hacks at TestStand.
Step 1. Load Wafer
Step 2. Press Center button – Wafer will move to CCD to do alignment or scan
Step 3. Align the first die (Auto or Manual)
Step 4. Adjust the needles to position on the pad
Step 5. Tester software – change measurement parameters(or recipe) and change to standby mode to wait for trigger from Prober
Step 6. Click [Start] button of Prober
Step 7. Prober will move and make contact then send out the command to tester
[P->T]: SOTX___Y___[LF] (ex. SOTX0Y0, SOTX-1Y-10,SOTX10Y-1)
[T->P]: SOT[LF]
Step 8. Tester receive SOT command, it will begin to do measurement
Step 9. Measurement finish, tester will send out end of test command to prober
[T->P]: EOTP or EOTF or EOTPW or EOTFW[LF] – P:Pass F:Fail W: End of test
[P->T]: EOT
Step 10. Prober move to next die(if receive W, go to step 12)
Step 11. Repeat Step 7~ Step 10 until last die
Step 12. Prober send out [EOW[LF]] command to inform tester the wafer is finished.
Step 13. Tester can close file and open new one for next wafer.
The attached files are just my 1st hacks at TestStand.
Step 1. Load Wafer
Step 2. Press Center button – Wafer will move to CCD to do alignment or scan
Step 3. Align the first die (Auto or Manual)
Step 4. Adjust the needles to position on the pad
Step 5. Tester software – change measurement parameters(or recipe) and change to standby mode to wait for trigger from Prober
Step 6. Click [Start] button of Prober
Step 7. Prober will move and make contact then send out the command to tester
[P->T]: SOTX___Y___[LF] (ex. SOTX0Y0, SOTX-1Y-10,SOTX10Y-1)
[T->P]: SOT[LF]
Step 8. Tester receive SOT command, it will begin to do measurement
Step 9. Measurement finish, tester will send out end of test command to prober
[T->P]: EOTP or EOTF or EOTPW or EOTFW[LF] – P:Pass F:Fail W: End of test
[P->T]: EOT
Step 10. Prober move to next die(if receive W, go to step 12)
Step 11. Repeat Step 7~ Step 10 until last die
Step 12. Prober send out [EOW[LF]] command to inform tester the wafer is finished.
Step 13. Tester can close file and open new one for next wafer.
Jason T.
100% (11)Projects Completed
5
Freelancers worked with
4
Projects awarded
35%
Last project
23 Feb 2019
Australia
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